The Four Techniques You Need to Know to Cool AI Data Centers

The growing need for high-density data centers to support AI and other demanding workloads is driving more data center teams to adopt liquid cooling rather than more traditional air-cooling methods for the IT critical load. But outside of hyperscalers, many data center teams are still learning the different liquid-cooling methods that exist and how they can make sure deployment goes smoothly.

There are four base design options for liquid cooling to consider: traditional hot/cold aisle containment, rear-door heat exchangers, direct-to-chip cooling, and immersion cooling. The latter three options far outperform traditional air-cooling systems, which may be insufficient for cooling the power-hungry racks in high-density data centers on its own. 

Each of these options has its own unique performance ranges and deployment and maintenance demands that need to be considered.

Wesco’s Alan Farrimond explains each of the liquid cooling options and what data center teams should be thinking about so they can choose the right option for their project.

Read the full article online from Data Centre Review to learn more